Are Slice-Based Cohesion Metrics Actually Useful in Effort-Aware Post-Release Fault-Proneness Prediction? : An Empirical Study

Yang, Yibiao; Zhou, Yuming; Lu, Hongmin; Chen, Lin; Chen, Zhenyu

dc.contributor.author	Yang, Yibiao
dc.contributor.author	Zhou, Yuming
dc.contributor.author	Lu, Hongmin
dc.contributor.author	Chen, Lin
dc.contributor.author	Chen, Zhenyu
dc.date.accessioned	2022-03-16T09:33:31Z
dc.date.available	2022-03-16T09:33:31Z
dc.date.issued	2015
dc.identifier.issn	0098-5589
dc.identifier.uri	http://repository.usthb.dz//xmlui/handle/123456789/9119
dc.description	331-357 p. ; 1.135ko.	en_US
dc.language.iso	en	en_US
dc.publisher	Institute of electrical and electronics engineers	en_US
dc.subject	Génie du logiciel	en_US
dc.subject	Logicielle de Halstead	en_US
dc.subject	Métriques logicielles	en_US
dc.subject	Logiciels open source	en_US
dc.subject	Logiciels : Développement	en_US
dc.subject	Distribution de défauts logiciel	en_US
dc.title	Are Slice-Based Cohesion Metrics Actually Useful in Effort-Aware Post-Release Fault-Proneness Prediction? : An Empirical Study	en_US
dc.type	Article	en_US