Are Slice-Based Cohesion Metrics Actually Useful in Effort-Aware Post-Release Fault-Proneness Prediction? : An Empirical Study

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dc.contributor.authorYang, Yibiao
dc.contributor.authorZhou, Yuming
dc.contributor.authorLu, Hongmin
dc.contributor.authorChen, Lin
dc.contributor.authorChen, Zhenyu
dc.date.accessioned2022-03-16T09:33:31Z
dc.date.available2022-03-16T09:33:31Z
dc.date.issued2015
dc.description331-357 p. ; 1.135ko.en_US
dc.identifier.issn0098-5589
dc.identifier.urihttp://repository.usthb.dz//xmlui/handle/123456789/9119
dc.language.isoenen_US
dc.publisherInstitute of electrical and electronics engineersen_US
dc.subjectGénie du logicielen_US
dc.subjectLogicielle de Halsteaden_US
dc.subjectMétriques logiciellesen_US
dc.subjectLogiciels open sourceen_US
dc.subjectLogiciels : Développementen_US
dc.subjectDistribution de défauts logicielen_US
dc.titleAre Slice-Based Cohesion Metrics Actually Useful in Effort-Aware Post-Release Fault-Proneness Prediction? : An Empirical Studyen_US
dc.typeArticleen_US

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